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Product description

RS-15H is an epoxy film adhesive developed to provide maximum compatibility and adhesive performance for core / face skin structures, co-curing, and secondary bonding. RS-15H is highly flexible with respect to processing and is compatible with all types of reinforcements and cores. RS-15H has been evaluated and qualified in areas ranging from marine to aerospace and dielectric structures. RS-15H may also be cured at temperatures as low as 80°C (176°F), and is compatible with the RS-1 family of prepregs.

Product benefits/features

  • Low temperature curing adhesive

Market segments

  • Space & Satellite
  • Aerostructures
  • Radome


Product category Film adhesives
Processing Out of Autoclave / Vacuum bag
Press forming
Resin type Epoxy
Tg (Dry, onset) 99 °C / 210 °F
Cure temperature (Optimal) 93 °C / 199 °F
Cure temperature (Lowest) 80 °C / 176 °F
Cure temperature (Highest) 93 °C / 199 °F
Out time 30 days

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