Product

TC890

Download datasheet

Product description

TC890 high temperature polyimide prepreg system utilizes P²SI® 900HT resin system. 900HT is a high-temperature, polyimide-based thermoset prepreg with service temperature capability up to 538°C (1000°F).

TC890 is an excellent non MDA replacement for high temperature PMR-15 applications. The 900HT resin system is an easily processable, thermally stable, polymer exhibiting the highest glass transition temperature of commercially available structural matrices.

TC890 displays exceptional toughness, superb low dielectric constant and loss properties, low toxicity and maintains mechanical integrity even after exposures in excess of 704°C (1300°F).

Product benefits/features

  • Non MDA PMR-15 replacement
  • Short term service temperature capability of 538°C (1000°F)

Market segments

  • High Temperature
  • Aerostructures
  • Radome

Details

Product category Thermoset Prepreg
Processing AFP/ATL
Press forming
Post curable
Autoclave
Resin type Polyimide
Tg (Dry, onset) 454 °C / 849 °F
Cure temperature (Optimal) 371 °C / 700 °F
Cure temperature (Lowest) 371 °C / 700 °F
Cure temperature (Highest) 371 °C / 700 °F
Out time 14 days
Post curable

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