Product

TC275-1

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Product description

TC275-1 is a dual cure toughened epoxy prepreg designed to facilitate composite part construction with low pressure or vacuum pressure cures. TC275-1’s out time allows the lay-up of thick or larger composite structure.

TC275-1 may be cured at a lower temperature of 135°C (275°F) or can be cured at 177°C (350°F) for higher temperature service.

Product benefits/features

  • Low moisture uptake, high Tg retention
  • Ideal system for large structures
  • OOA/VBO processable

Market segments

  • Launch
  • Space & Satellite
  • Aerostructures

Details

Product category Thermoset Prepreg
Processing Out of Autoclave / Vacuum bag
AFP/ATL
Press forming
Post curable
Autoclave
Resin type Epoxy
Tg (Dry, onset) 183 °C / 361 °F
Cure temperature (Optimal) 135 °C / 275 °F
Cure temperature (Lowest)135 °C / 275 °F
Cure temperature (Highest)177 °C / 351 °F
Out time 14 days
Post curable

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