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Product description

TC4015 cyanate ester film adhesive has been formulated for use in specific applications where low moisture absorption and high temperature bond strength is important. TC4015’s strength and toughness when bonding solid, honeycomb or foam core structures is comparable and often greater than high performance epoxy and polyimides, especially at elevated temperatures.

Due to the cyanate ester resin system’s inherently low shrinkage during cure, bonded structures will retain less inherent stress and will therefore remain dimensionally stable during thermal cycling. This factor is of extreme importance when bonding structures for use in space. Finally, like other cyanate ester based products, the TC4015 film adhesive displays low outgassing and good microcracking resistance to assure structural integrity even after severe environmental exposure.

Product benefits/features

  • Excellent high temperature properties
  • Compatible with TC420

Market segments

  • High Temperature
  • Launch
  • Space & Satellite
  • Aerostructures
  • Radome


Product category Film adhesives
Processing Out of Autoclave / Vacuum bag
Press forming
Post curable
Resin type Cyanate Ester
Tg (Dry, onset) 321 °C / 610 °F
Cure temperature (Optimal) 177 °C / 351 °F
Cure temperature (Lowest) 177 °C / 351 °F
Cure temperature (Highest) 177 °C / 351 °F
Out time 14 days
Post curable

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