Product

TC310

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Product description

TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. TC310 is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

Product benefits/features

  • Ideal composite bonding film adhesive

Market segments

  • High Temperature
  • Launch
  • Space & Satellite
  • Aerostructures
  • Radome

Details

Product category Film adhesives
Processing Out of Autoclave / Vacuum bag
Press forming
Autoclave
Resin type Epoxy
Tg (Dry, onset) 157 °C / 315 °F
Cure temperature (Optimal) 177 °C / 351 °F
Cure temperature (Lowest)121 °C / 250 °F
Cure temperature (Highest)177 °C / 351 °F
Out time 21 days

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