Products

TenCate Cetex® TC1220 is a semi-crystalline polyetheretherketone thermoplastic composite UD tape, offering high CAI strength. In addition to its structural properties, it has excellent resistance to solvents and is flame retardant.

TenCate AmberTool® TC40 is a BMI composite tooling prepreg, which provides excellent elevated temperature properties and processability. TenCate AmberTool® TC40 has been designed for high temperature tooling applications.

TenCate AmberTool® HX40 is an epoxy composite tooling prepreg. After a suitable post-cure an end-use temperature of 190ºC (374ºF) is achieved. TenCate AmberTool® HX40 is ideal for high temperature larger scale tooling.

TenCate AmberTool® HX32-1 is an epoxy composite tooling prepreg. After a suitable post-cure an end-use temperature of 140ºC (284ºF) is achieved. TenCate AmberTool® HX32-1 is ideal for large tooling applications.

TCF4050 is an expanding cyanate ester syntactic film (core splice) with flatwise tensile strength up to 260°C (500°F). TCF4050 is compatible with TenCate’s high temperature TC420 prepregs.

TCF4045 is a low-density epoxy syntactic film. TCF4045 displays both good mechanical and low dielectric loss and constant properties. TCF4045’s base resin chemistry features low moisture absorption with good high temperature properties.

TCF4035 is a syntactic epoxy film compatible with 121°C (250°F) prepregs. It features a long out time and is offered in a density of approximately 0.6 g/cc (40 ± 4 pounds per cubic foot).

TC420 is a flow controlled cyanate ester prepreg, toughened to resist microcracking. TC420 is ideal for out of autoclave large structures in ultra high temperature applications. It is easy to process and yields a low void content under vacuum bag only.

TC350-1 is a toughened epoxy prepreg with mechanical property translation and excellent hot/wet performance. TC350-1 is easily processed via out of autoclave or press curing operations. TC350-1 is available in extensive fiber reinforcement formats.

TC310 is a toughened epoxy film adhesive with excellent mechanical properties and toughness. TC310 is ideal for honeycomb or laminate bonding and may be cured in either autoclave or vacuum bag processing.

TC263 is a toughened, high peel strength, structural epoxy film adhesive for honeycomb core and laminate bonding. TC263 may be used in low pressure vacuum only, "out of autoclave" processes or in autoclave processes at 15 psi.

RS-8HT is a BMI resin which provides excellent elevated temperature properties and processability. RS-8HT has been evaluated and qualified in the areas of satellite and airframe / missile structures.

RS-1 is an epoxy prepreg which provides an excellent balance of mechanical properties, toughness and modulus. RS-1 has been evaluated and qualified in areas ranging from marine to aerospace. RS-1 is also available in a 80°C curing formulation.

EX-1516 cyanate ester film adhesive which has been formulated for low moisture absorption and / or low dielectric constant and loss applications. EX-1516 provides strength and toughness when bonding solid, honeycomb or foam core structures.

E732 is a snap cure toughened epoxy resin matrix optimized for press curing (compression molding) prepreg applications. With a cure time of 4 minutes at 160°C (320°F), an onset Tg of 170°C (338°F) is achieved.

E726 is a 120°C (248°F) cure toughened epoxy prepreg with controlled flow. E726 is designed for use within medical and industrial applications. E726 is compatible for co-cure with EF72 film adhesive and Amlite SC72A syntactic core.

E720 is a 120°C (248°F) cure toughened epoxy prepreg. E720 offers excellent adhesive properties, allowing direct lamination to honeycomb without the use of a film adhesive.

C740 is a 135°C (275°F) cure cyanate ester component prepreg. C740 is capable of withstanding very high temperatures and is inherently flame retardant. After a suitable postcure the glass transition temperature can be increased to as high as 325°C (617°F).

BTCy-2 is TenCate’s lowest dielectric constant and loss cyanate ester prepreg. BTCy-2's resin system is valued in high energy radomes as a result of it’s low loss tangent. BTCy-2 is also resistant to microcracking.

BTCy-1 is a 177°C (350°F) curing cyanate ester prepreg and is an industry standard for use on satellite structures and radomes.

BT250E-6 is a 121°C cure epoxy prepreg with excellent strength and stiffness. It provides an outstanding surface finish with vacuum bag/oven cure only. BT250E-6 has an FAA conformed database on carbon IM7 UD tape, AS-4C plain weave, 7781, and S-2 glass.

BT250E-1 is a 121°C (250°C) cure epoxy prepreg with excellent toughness and strength. It provides an outstanding surface finish with VBO. BT250E-1 is self-adhesive to honeycomb and foam core and, is MIL-R-9300 qualified.

Amlite SC72A is a low-density unsupported epoxy syntactic core. SC72A offers reduced processing, a one-shot cure, the ability to anchor inserts or fastenings and increases the opportunity to consider light weight, thin walled composite sandwich structures.

8020-FR is a toughened epoxy component prepreg offers excellent structural properties, flame retardancy and toughness. The TenCate 8020-FR resin system has been developed to offer a long outlife and flexible cure schedules from 70-120°C (158-248°F).

8020 toughened epoxy component prepreg offers an excellent balance of mechanical properties and excellent surface finish. The TenCate 8020 resin system has been developed to offer a long outlife and flexible cure schedules from 70-130°C (158-266°F).